Bleiker, Simon: search on Z-Library

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1

Integrating MEMS and ICs

Fischer, Andreas C., Forsberg, Fredrik, Lapisa, Martin, Bleiker, Simon J., Stemme, Göran, Roxhed, Niclas, Niklaus, Frank

Journal:

Microsystems & Nanoengineering

Year:

2015

Language:

english

File:

PDF, 9.04 MB

english, 2015

2

High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires

Bleiker, Simon J., Fischer, Andreas C., Shah, Umer, Somjit, Nutapong, Haraldsson, Tommy, Roxhed, Niclas, Oberhammer, Joachim, Stemme, Goran, Niklaus, Frank

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 4.28 MB

english, 2015

3

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Bleiker, Simon, Visser Taklo, Maaike, Lietaer, Nicolas, Vogl, Andreas, Bakke, Thor, Niklaus, Frank

Journal:

Year:

2016

Language:

english

File:

PDF, 3.99 MB

english, 2016

4

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Wafer-level heterogeneous 3D integration for MEMS and NEMS

Niklaus, Frank, Lapisa, Martin, Bleiker, Simon J., Dubois, Valentin, Roxhed, Niclas, Fischer, Andreas C., Forsberg, Fredrik, Stemme, Goran, Grogg, Daniel, Despont, Michel

Year:

2012

Language:

english

File:

PDF, 3.63 MB

english, 2012

5

Wafer-Level Vacuum Packaging Enabled by Plastic Deformation and Low-Temperature Welding of Copper Sealing Rings With a Small Footprint

Wang, Xiaojing, Bleiker, Simon J., Antelius, Mikael, Stemme, Goran, Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2017

Language:

english

File:

PDF, 3.96 MB

english, 2017

6

Nanoelectromechanical digital logic circuits using curved cantilever switches with amorphous-carbon-coated contacts

Ayala, Christopher L., Grogg, Daniel, Bazigos, Antonios, Bleiker, Simon J., Fernandez-Bolaños, Montserrat, Niklaus, Frank, Hagleitner, Christoph

Journal:

Solid-State Electronics

Year:

2015

Language:

english

File:

PDF, 1.98 MB

english, 2015

7

[IEEE 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) - San Francisco, CA, USA (2014.01.26-2014.01.30)] 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) - Amorphous carbon active contact layer for reliable nanoelectromechanical switches

Grogg, Daniel, Ayala, Christopher L., Drechsler, Ute, Sebastian, Abu, Koelmans, Wabe W., Bleiker, Simon J., Fernandez-Bolanos, Montserrat, Hagleitner, Christoph, Despont, Michel, Duerig, Urs T.

Year:

2014

Language:

english

File:

PDF, 1.79 MB

english, 2014

8

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Laakso, Miku J., Bleiker, Simon J., Liljeholm, Jessica, Martensson, Gustaf E., Asiatici, Mikhail, Fischer, Andreas C., Stemme, Goran, Ebefors, Thorbjorn, Niklaus, Frank

Journal:

Year:

2018

Language:

english

File:

PDF, 2.57 MB

english, 2018

9

Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays

Qin, Tian, Bleiker, Simon J., Rana, Sunil, Niklaus, Frank, Pamunuwa, Dinesh

Journal:

Year:

2018

Language:

english

File:

PDF, 5.31 MB

english, 2018

10

[IEEE 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) - Shanghai, China (2016.1.24-2016.1.28)] 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS) - High-speed metal-filling of through-silicon vias (TSVs) by parallelized magnetic assembly of micro-wires

Bleiker, Simon J., Fischer, Andreas C., Niklaus, Frank

Year:

2016

Language:

english

File:

PDF, 1001 KB

english, 2016

11

[IEEE 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) - Kaohsiung (2017.6.18-2017.6.22)] 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) - Narrow footprint copper sealing rings for low-temperature hermetic wafer-level packaging

Wang, Xiaojing, Bleiker, Simon J., Antelius, Mikael, Stemme, Goran, Niklaus, Frank

Year:

2017

Language:

english

File:

PDF, 1.70 MB

english, 2017

12

Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages

Wang, Xiaojing, Bleiker, Simon J., Edinger, Pierre, Errando-Herranz, Carlos, Roxhed, Niclas, Stemme, Goran, Gylfason, Kristinn B., Niklaus, Frank

Journal:

Journal of Microelectromechanical Systems

Year:

2019

Language:

english

File:

PDF, 49 KB

english, 2019

13

Scalable Manufacturing of Nanogaps

Dubois, Valentin, Bleiker, Simon J., Stemme, Göran, Niklaus, Frank

Journal:

Advanced Materials

Year:

2018

Language:

english

File:

PDF, 5.08 MB

english, 2018

14

Nanoelectromechanical relay without pull-in instability for high-temperature non-volatile memory

Rana, Sunil, Mouro, JoÃ£o, Bleiker, Simon J., Reynolds, Jamie D., Chong, Harold M. H., Niklaus, Frank, Pamunuwa, Dinesh

Journal:

Nature Communications

Year:

2020

File:

PDF, 2.23 MB

2020

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